현황 및 조립 사이트 소개
전체 PLANT 1, 2, 3, 4개의 조립 라인으로 각각의 4개 계열사로 구성되어 있습니다.
- PACKAGE LINE-UP
- 회사명
- SITE
- TO220FB-3L, TO220AB-3L, TO220NB-3L/5L, TO263NB-3L/5L, TO220F-3L, DPAK, TO247, TO3P, TO263-2L/3L, TO262
- TianShui HuaTian Technology Co.,Ltd
- http://www.tsht.com/
- DIP, SOT, SOP, ESOP, MSOP, SSOP, LQFP
- Huatian Technology Co.,Ltd
- http://www.tshtkj.com/
- TSSOP, QFN, DFN, BGA, LGA
- Huatian Technology(Xian) Co.,Ltd
- WLP, WLC, WLO
- Huatian Technology(Kunshan) Co.,Ltd
- http://www.htkjks.com/
생상능력
- Items
- Process Capability
- Scribe width
- Min=50μm
- Die-attach chip size
- Min=250×250μm
- Pad opening for Au
- Min=36×36μm
- Pad opening fir Cu
- Min=40×40μm
- Bond Pad Pitch for Au
- Min=43×43μm
- Bond Pad Pitch for Cu
- Min=45×45μm
- Bond pad metal for Au
- Min=Al 0.4μm
- Bond pad metal for Cu
- Min=Al 0.8μm or AlCu & AlSiCu 0.6μm
